Contact US

Log In

Come Join Us!

Are you an
Engineering professional?
Join Eng-Tips Forums!
  • Talk With Other Members
  • Be Notified Of Responses
    To Your Posts
  • Keyword Search
  • One-Click Access To Your
    Favorite Forums
  • Automated Signatures
    On Your Posts
  • Best Of All, It's Free!

*Eng-Tips's functionality depends on members receiving e-mail. By joining you are opting in to receive e-mail.

Posting Guidelines

Promoting, selling, recruiting, coursework and thesis posting is forbidden.

Students Click Here

Foreign object analysis of CMOS sensor via SEM/EDS

Foreign object analysis of CMOS sensor via SEM/EDS

Foreign object analysis of CMOS sensor via SEM/EDS

Hi All,
I was confused of about the failure analysis while I studying the foreign object on CMOS analysis.
Few un-identified objects were found in sensor surface after die/wire bonding.
Any comments on these objects are highly appreciated.

Thank you

All best,
Confused Engineer

RE: Foreign object analysis of CMOS sensor via SEM/EDS

A typical CMOS sensor

RE: Foreign object analysis of CMOS sensor via SEM/EDS

Are you sure this came from the wire bonding step? Could this be left over photoresist that didn't get washed off?

RE: Foreign object analysis of CMOS sensor via SEM/EDS

Or a flake of dead skin...

RE: Foreign object analysis of CMOS sensor via SEM/EDS

The analyses you presented suggests this is composed of nitrogen, sulfur, and calcium. It may well be organic but carbon is the overwhelming peak for exemplar and contaminant so you can't tell that way. Two things I would do is recollect the spectra down at about 8 keV to crank down the beam penetration, helping with contaminant identification. Semiquants are useful for this purpose of contaminant identification, but I would not include carbon at all - procedure notes carbon cannot be quantified due to its low atomic weight, so the numbers for it just confuses the issue.

Red Flag This Post

Please let us know here why this post is inappropriate. Reasons such as off-topic, duplicates, flames, illegal, vulgar, or students posting their homework.

Red Flag Submitted

Thank you for helping keep Eng-Tips Forums free from inappropriate posts.
The Eng-Tips staff will check this out and take appropriate action.

Reply To This Thread

Posting in the Eng-Tips forums is a member-only feature.

Click Here to join Eng-Tips and talk with other members! Already a Member? Login


Low-Volume Rapid Injection Molding With 3D Printed Molds
Learn methods and guidelines for using stereolithography (SLA) 3D printed molds in the injection molding process to lower costs and lead time. Discover how this hybrid manufacturing process enables on-demand mold fabrication to quickly produce small batches of thermoplastic parts. Download Now
Design for Additive Manufacturing (DfAM)
Examine how the principles of DfAM upend many of the long-standing rules around manufacturability - allowing engineers and designers to place a part’s function at the center of their design considerations. Download Now
Taking Control of Engineering Documents
This ebook covers tips for creating and managing workflows, security best practices and protection of intellectual property, Cloud vs. on-premise software solutions, CAD file management, compliance, and more. Download Now

Close Box

Join Eng-Tips® Today!

Join your peers on the Internet's largest technical engineering professional community.
It's easy to join and it's free.

Here's Why Members Love Eng-Tips Forums:

Register now while it's still free!

Already a member? Close this window and log in.

Join Us             Close