Modal analysis after contact

[slumdogengineer]

Dear All,

I am running an analysis where two surfaces contact, then are bonded on contact. This seems to be perfectly possible in Ansys. What I would then like to do is run a modal analysis on the bonded assembly, by a restart. Does anyone know if it is possible or impossible to do this? I have a suspicion that it might not be possible... :S

Thanks
Will

 

[Drej]

You may be able to use the UPGEOM command to obtain the deformed geometry and then "tie" the surfaces together. The tie will need to be a linear contact condition for it to work in the modal analysis.


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[slumdogengineer]

Thanks, I am still battling with the original contact analysis but that looks promising. Did you mean to "tie" the surfaces with rigid MPC elements for example?