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Solid-state thermal-interface bondline: Silicon bonded directly to aluminum

Solid-state thermal-interface bondline: Silicon bonded directly to aluminum

Solid-state thermal-interface bondline: Silicon bonded directly to aluminum

(OP)
What design and cost advantages could be gained, in what applications, with the bonding of silicon wafer -- the heat source in power devices -- directly to aluminum -- the heat sink..?

Despite the massive CTE-mismatch, we've shown that this Si-on-Al laminaion is possible, with the bondline being able to survive thermal shock and aging ... but haven't been able to quantify the advantages and/or identify targeted applications. It seems that electronic-packaging folks conservatively stick with the conventions of layered laminates to step down the CTE, from aluminum's 23 ppm/oC to silicon's 2.6 ppm/oC.

Thanks!

RE: Solid-state thermal-interface bondline: Silicon bonded directly to aluminum

Hard to believe no one is kicking your door down for this. What's the effect on electrical performance from very high and variable strain on the silicon?

RE: Solid-state thermal-interface bondline: Silicon bonded directly to aluminum

Quote:

bondline being able to survive thermal shock and aging

Lattice strain changes the bandgap, which drastically changes the performance of silicon as a semiconductor. The bondline was the least of the problems.

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RE: Solid-state thermal-interface bondline: Silicon bonded directly to aluminum

It also occurs to me this will tend to put the rather brittle silicon into tension and the top surface is covered in stress raising notches.

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