To fail or not to fail - expensive devices
To fail or not to fail - expensive devices
(OP)
Hi,
I'm looking for information regarding BGA failures at test. Currently when test equipment fails a populated PCB and in some cases the BGA is identified as the faulty by Diagnostics. The device is x-rayed whilst on the board to prove the solder connections before removal, in most cases good soldering is shown. The device is then returned to the manufacturer. I had a phone call from a BGA Investigations Engineer this morning looking for more information on a particular return. Whilst I had him on the phone I quizzed him regarding returns to which he answered that in the region of 85% of returned devices are shown to be functionaly good. Has anybody experience of this scenario or where I am supposed to go next with regards to the investigation and resolution of this problem ?
I'm looking for information regarding BGA failures at test. Currently when test equipment fails a populated PCB and in some cases the BGA is identified as the faulty by Diagnostics. The device is x-rayed whilst on the board to prove the solder connections before removal, in most cases good soldering is shown. The device is then returned to the manufacturer. I had a phone call from a BGA Investigations Engineer this morning looking for more information on a particular return. Whilst I had him on the phone I quizzed him regarding returns to which he answered that in the region of 85% of returned devices are shown to be functionaly good. Has anybody experience of this scenario or where I am supposed to go next with regards to the investigation and resolution of this problem ?
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