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Thermal stress on PCB results review on soldering joints

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aerospace120

New member
Joined
Jan 14, 2016
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2
Location
DE
Dear all,

I have done thermal stress analysis on PCB using ANSYS, I would like to how can I review the reliability of the PCB with the stress from FEM analysis. How can I says that design fails or pass ? what are critical points from the results for soldering purposes ?

Thanks in advance,

 
It sounds like a full-scale research project, with lots of different issues and possibilities involved.
 
Please refrain from using colors in this fashion; it's akin to shouting.

Are you a student?

Does your FEA package account for fatique?

TTFN
I can do absolutely anything. I'm an expert!
homework forum: //faq731-376 forum1529
 
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