Hi guys,
I'm relatively new to this forum, and I need your help with a problem.
I’m working in the semiconductor industry and I have an analysis that involves simulating the assembly process of a flip chip. I basically need to stress my model with:
1) Reflow (say above 220DegC)
2) Cooling to room temp and recording the residual stress
3) Thermal cycling and recording the deformation and stress at various intervals (50cycles, 500 cycles, 1000 cycles etc)
It would be a big help if anyone can give me a few pointers on how to go about extracting residual stress and stress/strain at thermal cycling intervals. I model both in APDL and interactive mode, but I am more comfortable applying loads in interactive mode.
Thank you all for your help in advance! =)
I'm relatively new to this forum, and I need your help with a problem.
I’m working in the semiconductor industry and I have an analysis that involves simulating the assembly process of a flip chip. I basically need to stress my model with:
1) Reflow (say above 220DegC)
2) Cooling to room temp and recording the residual stress
3) Thermal cycling and recording the deformation and stress at various intervals (50cycles, 500 cycles, 1000 cycles etc)
It would be a big help if anyone can give me a few pointers on how to go about extracting residual stress and stress/strain at thermal cycling intervals. I model both in APDL and interactive mode, but I am more comfortable applying loads in interactive mode.
Thank you all for your help in advance! =)