I have creatd an assembly and would like to model the solder between components for thermal and structural detail. The issue I have is that the solder is 0.002" thick and creates over 10,000 elements. Is there a better way to represent the solder in the assembly? There are 4 layers of solder in the model. The model is 3-D. I am using ANSYS 9.0 and Inventor to create the SAT files. Please help!
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Modeling Solder "thin volumes" in ANSYS???
- Thread starter Damienb
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