tomwalz
Materials
- May 29, 2002
- 947
Lead-free solder process or alternate process such as epoxy for applications (above 200 °C).
Must be lead-free
Must be suitable for temperature applications 200 - 250 °C
Types of materials to be soldered:
Must be compatible with ceramics and passive devices on polyimide PCB and MCM substrates
Compatibility with plastic packaging would also be of interest
Durability:
1 year at 200 °C (or more) steady state (no thermal cycles, few mechanical shocks)
1000 hours at 200 °C (or more) with thermal cycles and many mechanical shocks
Technologies should be adaptable for low and high power boards
Thomas J. Walz
Carbide Processors, Inc.
Must be lead-free
Must be suitable for temperature applications 200 - 250 °C
Types of materials to be soldered:
Must be compatible with ceramics and passive devices on polyimide PCB and MCM substrates
Compatibility with plastic packaging would also be of interest
Durability:
1 year at 200 °C (or more) steady state (no thermal cycles, few mechanical shocks)
1000 hours at 200 °C (or more) with thermal cycles and many mechanical shocks
Technologies should be adaptable for low and high power boards
Thomas J. Walz
Carbide Processors, Inc.