Actually, there not much in the way of analysis with respect to 300 mm wafers; they're roughly twice as thick as the 150 mm, although their stiffness is more than doubled. Most IC manufacturers simply get wafers from Wacker or another supplier and their equipment is built to handle the variations in thickness in the material. The biggest stresses experienced by wafers are thermal ones during furnace operations, mechanical stresses are always minimized as a matter of course to prevent breakage.
Most FEA in the silicon arena is for the micromachined widgets such as accelerometers, gyros, etc.
TTFN