Glue Surface-to-Surface FEMAP with NX Nastran

[jacasalr]

Hello everybody!

I am wondering if the function glue surface-to-surface of FEMAP provides an option to set up the Coefficient of Thermal Expansion when defining the Connection Property. I am doing some simulations where the thermal load is critical (and I have solids joining) but I am getting errors in my results because of this.

Thanks a lot in advance.

Kind regards,

Julio