ISBind
Mechanical
- Jun 30, 2011
- 24
Greetings
Can any one tell in what cases which formulation method should be used for bonded connection and no separation (MPC or Pure penalty) ???
Also which formulation method to use for frictional, friction less and rough connection???
Thanks
Can any one tell in what cases which formulation method should be used for bonded connection and no separation (MPC or Pure penalty) ???
Also which formulation method to use for frictional, friction less and rough connection???
Thanks