Finding "Rt" is the hard part. Rt is not just the conductive resistance inside the heat source (theta j-c for chip packages), it's the resistance from the heat source to the ambient air (theta j-a).
Theta j-a includes conduction, convection, and radiation and can vary dramatically depending on nearby components, airflow, surface area, PCB copper, finish, etc, etc.
JEDEC has a standardized test that defines these variables -- very useful for comparing chip packages, but useless for predicting results in your system.