Hi,

I have an application which requires copper, tin, and lead to coexist in a 100 degree Celsius water enviroment for long periods of time (5 to 20 years life times) without generating non-condensable gases due to corrosion. The application requires that less than 1 gram of water be sealed in a copper container, which uses lead-tin solder to make seals and form joints.

There is also a second very similar application that requires copper, phosphor bronze, lead, and tin to coexist in a 100 degree Celsius environment without producing non condensable gases.

I would  appreciate if someone could point out whether these are compatible material sets and if they aren't if there is any conditioning that I can do to the surface of these materials to prevent the formation of non condesable gases. I can not add corrosion inhibitors to the water because that would reduce the surface tension of the water and my application requires the highest possible surface tension.

Thanks.  

abp