Wanted: EE guest authors and bloggers for Electronics Cooling Magazine
Wanted: EE guest authors and bloggers for Electronics Cooling Magazine
(OP)
As electronic products are becoming smaller, the circuit heat dissipations have not reduced accordingly. EEs are becoming more concerned with thermal management and MEs are becoming more concerned with heat dissipation.
Now I've been an ME for a while doing electronic packaging and my experience has shown that worst-case circuit heat dissipation estimates provided by the EE design engineer are ultra-conservative and lead to over-design and unnecessary expense for thermal management. I've seen first-article product testing show real worst-case heat dissipation can be as little as 1/3 that of the estimate provided at the start of the design! But by then it was always too late to spin the design again to remove the unneeded thermal management hardware!
Guys I'm looking for EE guest authors and/or bloggers with experience in the estimation of most-likely maximum circuit heat dissipations who would be willing to contribute in the Electronics Cooling Magazine (ECM) publication and website blogs. Analog, RF, digital, or mixed, doesn't matter. The theory and general approaches are what we want to know about. I don't think the software used is important. This subject may take more than one blog so us electronic packaging guys and ECM would be really grateful if he/she would be willing to do a series if necessary. In fact one or more feature articles are also a possibility. BTW I'm not on the ECM staff but I'm becoming a first-time contributor soon. If it's too global to think the subject can be addressed for all circuit types at once, then maybe a few guys will be needed: one for digital, one for analog, and one for RF. Hopefully multiple treatments like this can be combined to address mixed-technology circuits.
Granted, the ECM target audience is thermal guys (usually MEs) and they may not be able to follow it all, they can at least share it with their EE colleagues who will surely benefit from it. ECM is non-profit and contributions are not compensated.
Thanks,
Bruce
Now I've been an ME for a while doing electronic packaging and my experience has shown that worst-case circuit heat dissipation estimates provided by the EE design engineer are ultra-conservative and lead to over-design and unnecessary expense for thermal management. I've seen first-article product testing show real worst-case heat dissipation can be as little as 1/3 that of the estimate provided at the start of the design! But by then it was always too late to spin the design again to remove the unneeded thermal management hardware!
Guys I'm looking for EE guest authors and/or bloggers with experience in the estimation of most-likely maximum circuit heat dissipations who would be willing to contribute in the Electronics Cooling Magazine (ECM) publication and website blogs. Analog, RF, digital, or mixed, doesn't matter. The theory and general approaches are what we want to know about. I don't think the software used is important. This subject may take more than one blog so us electronic packaging guys and ECM would be really grateful if he/she would be willing to do a series if necessary. In fact one or more feature articles are also a possibility. BTW I'm not on the ECM staff but I'm becoming a first-time contributor soon. If it's too global to think the subject can be addressed for all circuit types at once, then maybe a few guys will be needed: one for digital, one for analog, and one for RF. Hopefully multiple treatments like this can be combined to address mixed-technology circuits.
Granted, the ECM target audience is thermal guys (usually MEs) and they may not be able to follow it all, they can at least share it with their EE colleagues who will surely benefit from it. ECM is non-profit and contributions are not compensated.
Thanks,
Bruce
H. Bruce Jackson
ElectroMechanical Product Development
UMD 1984
UCF 1993
RE: Wanted: EE guest authors and bloggers for Electronics Cooling Magazine
TTFN (ta ta for now)
I can do absolutely anything. I'm an expert! https://www.youtube.com/watch?v=BKorP55Aqvg
FAQ731-376: Eng-Tips.com Forum Policies forum1529: Translation Assistance for Engineers Entire Forum list http://www.eng-tips.com/forumlist.cfm
RE: Wanted: EE guest authors and bloggers for Electronics Cooling Magazine
H. Bruce Jackson
ElectroMechanical Product Development
UMD 1984
UCF 1993
RE: Wanted: EE guest authors and bloggers for Electronics Cooling Magazine
TTFN (ta ta for now)
I can do absolutely anything. I'm an expert! https://www.youtube.com/watch?v=BKorP55Aqvg
FAQ731-376: Eng-Tips.com Forum Policies forum1529: Translation Assistance for Engineers Entire Forum list http://www.eng-tips.com/forumlist.cfm
RE: Wanted: EE guest authors and bloggers for Electronics Cooling Magazine
EE's have to design for the worst case scenario's within the specifications of the product. Things like applied voltage tolerances, ambient temperature specifications, etc. all play into what the EE uses when considering thermal management. For example, if the voltage is listed as +- 10% and -10% is applied, the current needed typically goes up as result, producing more heat. If a product specs say it is good for up to 40C or 50C then that's the temperature used in considering thermal management. Couple this with a lower than desired voltage and any number of design parameters that could affect the heat dissipation requirements, it can add up quickly. Depending on the product, there are many other factors that play into heat calculations. Then there is a safety margin to consider. Perhaps, this is where opinions from EE's will vary the most. Obviously, safety applications require a higher safety margin than non-safety or non-critical operations.
I can see, now, how this could lead to a series of articles...
RE: Wanted: EE guest authors and bloggers for Electronics Cooling Magazine
H. Bruce Jackson
ElectroMechanical Product Development
UMD 1984
UCF 1993
RE: Wanted: EE guest authors and bloggers for Electronics Cooling Magazine
TTFN (ta ta for now)
I can do absolutely anything. I'm an expert! https://www.youtube.com/watch?v=BKorP55Aqvg
FAQ731-376: Eng-Tips.com Forum Policies forum1529: Translation Assistance for Engineers Entire Forum list http://www.eng-tips.com/forumlist.cfm
RE: Wanted: EE guest authors and bloggers for Electronics Cooling Magazine
Interesting subject.
RE: Wanted: EE guest authors and bloggers for Electronics Cooling Magazine
H. Bruce Jackson
ElectroMechanical Product Development
UMD 1984
UCF 1993
RE: Wanted: EE guest authors and bloggers for Electronics Cooling Magazine
Don't get me wrong, I think this should be considered and analyzed but only if the economics justify the consideration.
RE: Wanted: EE guest authors and bloggers for Electronics Cooling Magazine
H. Bruce Jackson
ElectroMechanical Product Development
UMD 1984
UCF 1993
RE: Wanted: EE guest authors and bloggers for Electronics Cooling Magazine
I don't disagree that statistics would be useful, but I guess I'm having trouble getting across that it's highly unlikely that anyone or even any committee of engineers could come up with statistics that have more applicability than the point designs they came from.
To wit, my laptop is cranking its fans full bore at the moment, mainly, I'm guessing because I'm streaming Netflix and Casting it to the widescreen. How is knowledge of what's going on in my laptop going to help the EEs designing our payload for a satellite? Different processors, electronics, peripherals, and functions all lead to differing power consumptions, and whatever functions we could enumerate for a laptop might have nothing whatsoever to do with a satellite payload. And even then, satellite payloads are different and have differing functions, sensors, and electronics. Now, we've usually got one guy doing the detailed design for the electronics, and, by the way, he's also designing the power supply. The power supply is roughly 1/20th of the total effort, so should spend gobs of time trying to optimize 5% of the design effort, when optimizing the remaining 95% could buy way more for the overall project. Any, the designer never needs to worry that some added new functionality or modification of an existing functionality could inadvertently push an optimized power supply beyond its statistically valid design.
TTFN (ta ta for now)
I can do absolutely anything. I'm an expert! https://www.youtube.com/watch?v=BKorP55Aqvg
FAQ731-376: Eng-Tips.com Forum Policies forum1529: Translation Assistance for Engineers Entire Forum list http://www.eng-tips.com/forumlist.cfm
RE: Wanted: EE guest authors and bloggers for Electronics Cooling Magazine
RE: Wanted: EE guest authors and bloggers for Electronics Cooling Magazine
Are you sure you posted in the right thread? I don't see how your post has any relation to the topic here.
H. Bruce Jackson
ElectroMechanical Product Development
UMD 1984
UCF 1993
RE: Wanted: EE guest authors and bloggers for Electronics Cooling Magazine
TTFN (ta ta for now)
I can do absolutely anything. I'm an expert! https://www.youtube.com/watch?v=BKorP55Aqvg
FAQ731-376: Eng-Tips.com Forum Policies forum1529: Translation Assistance for Engineers Entire Forum list http://www.eng-tips.com/forumlist.cfm
RE: Wanted: EE guest authors and bloggers for Electronics Cooling Magazine
But to the point of others here, the study would only apply for this specific product and circumstances, not products as a whole.
Dan - Owner
http://www.Hi-TecDesigns.com