Layered FR-4 is used in the manufacture of circuit cards (Printed wiring Boards). Interested in the composite thermal properties (thermal conductivity, specific heat, coefficient of thermal expansion,etc) of the multilayer (8, 10 or 12)boards. The typical thicnesses of the boards are 0.062 or 0.093 inches. Looking for literature,references, equations/formulas, etc., that can be quickly/conveniently applied to get reasonable values.
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