TurboXS
Electrical
- Mar 17, 2005
- 95
I have been having a debate with another engineer over the effectiveness of a thermal fuse being used to monitor parts on a PCB.
Imagine the following;
A PCB say 100 x 100mm fitted with parts such as ICs, resistors and MOSFETS.
The assembled PCB is encapsulated in a potting material such as Sylgard and a thermal fuse rated at 150 deg C is potted in the centre of the potting but say 5mm away from the PCB. The box that the potted assembly is in is say 100 x 100 x 50mm.
Lets say there is a resistor 5mm directly below the thermal fuse.
The discussion we are having here is;
How hot would the resistor get before it causes the thermal fuse to fail?
The other engineer tells me that Sylgard is 12 times more conductive than air. However given that air is a poor conductor this doesn't seem like a good indicator of its effectiveness.
I've tried searching but it looks like I might have to pull out my old Heat Transfer books out.
thanks
Pete
Imagine the following;
A PCB say 100 x 100mm fitted with parts such as ICs, resistors and MOSFETS.
The assembled PCB is encapsulated in a potting material such as Sylgard and a thermal fuse rated at 150 deg C is potted in the centre of the potting but say 5mm away from the PCB. The box that the potted assembly is in is say 100 x 100 x 50mm.
Lets say there is a resistor 5mm directly below the thermal fuse.
The discussion we are having here is;
How hot would the resistor get before it causes the thermal fuse to fail?
The other engineer tells me that Sylgard is 12 times more conductive than air. However given that air is a poor conductor this doesn't seem like a good indicator of its effectiveness.
I've tried searching but it looks like I might have to pull out my old Heat Transfer books out.
thanks
Pete