Thermal Analysis of a PCA

[cbk14]

Hi all, I'm trying to conduct a thermal analysis of an FPGA on a PCA. According to the data sheet the FPGA can be roughly modeled as a two-resistor network, with one resistor being the IC-junction to case thermal resistance and the other resistor being the IC-junction to board thermal resistance.

Now my question is how can I model the thermal resistance through the board to the other side? Any tips or ideas on where to look for good resources?

Thanks.

 

[Tunalover]

I suggest you post this in the Packaging Design Engineering forum. That's for EEs and MEs who deal with electronics including PCAs and FPGAs.

Tunalover

 

[IRstuff]

The thermal resistance should be available in the datasheet for the PCA supplier.

TTFN
faq731-376

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