As waross and VE1BLL posts point out, this topic can quickly turn into a very deep span subject and not so obvious issues that can turn up.
Hard to say from your post how large the span is of your grounding and bonding question really is. i.e. are the valves, detectors, etc contained within a single integrated product or are they going to be scattered throughout a large facility... is this is a one off application or a product you are designing that will need to meet a number of standards?
So far as signaling and sensor circuits, using differential signaling/balanced circuits that maintain good longitudinal balance can produce some impressive performance over distance in a larger system and have good immunity in a noisy environment. And as you already know, in-appropriate grounds can quickly make it all go wrong.
If your application spans a larger scope e.g. sensors in a large facility, then the telecommunications industry has volumes of standards, specs and installation practices to deal with grounding, bonding, transient protection, AC/DC common bonding as illustrated in this very good but very extensive scope document. Many topics not relevant to your question are covered but chapter 5 becomes applicable if your application is large facility in scope.
Cell sites, PBX centers and data centers with their typical use of AC and 48 volt DC plants, extensive signaling circuits have your issue on the large scale.
SCADA e.g. for manufacturing automation and instrumentation would also have volumes of information that could be of value to you.