First of all, thanks for the prompt feedback MacGyverS2000 and VE1BLL. Myself and the owner of the company realize we need to figure out the most efficient way to resolve this, even if that means hiring a consultant, so that dollars are not wasted on delays and testing. That said, we are real close and that's why I'm scratching my head at this point.
The machine was originally designed by a contracted freelance designer, I've been trying to figure out some of his logic and correct problematic areas. Originally the machine had little shielding and improper grounding of all components. A few areas that raised flags to me were the main PCB layout, which had no shield, and the camera CCD (PCB), where the I/O power connection is right next to a data cable connection on the board. I added a sheet metal enclosure (grounded) to the PCB layout which contained a CPU board, servo controller board, and a camera board. We also added wrap around self adhesive wire shielding (grounded) to the power wires that run to the camera CCD (PCB) and a grounded sheet metal shield over the board. This all helped (we were about 15dB over @ 75Mhz on the first test) but we're still a little off at higher frequencies.
What bothers me is how the geometry of the machine may affect the far field test results (how do we analyze/manage this) and how much consideration for EMI/EMC testing was taken into account during the original design. I'm concerned we may have to redesign some of the electronic layout. Like I said, I'm not an EE but I'm not sure how much experience the original designer has had with EMI/EMC testing.
Any additional feedback would be great! Thanks again!