Hi guys/gals
I wanted to ask if there are any ProE thermal users in this forum and if you like the package. What are the pros and cons of ProE Thermal in your application? My application would be to use it for electronic packaging from the junction temp of the device to heat sink and transient heating through the housing. Right now I am using TAS by Harvard Thermal. It is a great software, but I find my self building the model twice, once in ProE or ACAD and then in TAS. Since we have ProE, it would be nice to use the same model just like ProE Mechanica.
Any thoughts?
Thanks in advance for your comments.
Go Mechanical Engineering
Tobalcane
I wanted to ask if there are any ProE thermal users in this forum and if you like the package. What are the pros and cons of ProE Thermal in your application? My application would be to use it for electronic packaging from the junction temp of the device to heat sink and transient heating through the housing. Right now I am using TAS by Harvard Thermal. It is a great software, but I find my self building the model twice, once in ProE or ACAD and then in TAS. Since we have ProE, it would be nice to use the same model just like ProE Mechanica.
Any thoughts?
Thanks in advance for your comments.
Go Mechanical Engineering
Tobalcane
