problem with a motorola Power Pc BGA IC.

[garshelly]

Hi all,

I am having a problem with a motorola Power PC BGA component.The problem is that when the component is being placed on a pcb board by a operator(the component is being placed by a M/C) we are getting a lot off opens especially internal ones.Could you point me in the right direction to a possible solution to this problem as we are after trying many different ideas but to no avail.

Cheer's Gs.

 

[SteveBull]

Hi.
We've a Motorola Power BGA device(MPC860 PowerQUIC)) that was originally developed for use on very thin boards (something like 0.6mm material), when we solder the component on, we get a lot of opens because the device does not stay flat, we've increased the amount of solder paste applied in the area by use of a stepped paste mask, and the production yield has risen.
Regards,

Steve Steve Bull
Quality and Circuit Engineer.