julchak
Mechanical
- Oct 17, 2012
- 2
Hi everyone,
I'm a newly registered member here but have been onlooking for awhile now. Stuck on what I feel like should be an easy problem...but can't waste any more time trying different methods and need some guidance.
I am currently designing an electronics enclosure which I am trying to have maintain a near room level temperature for as long as possible in a freezer. My ambient air is moving, so I have forced convection. I will have a sturdy outer panel for the enclosure along with foam insulation on the inside.
I've been working on the calculations to determine the time it will take for the inside surface of the outer panel's wall to reach ambient temperature, and then to determine how long it will take for the insulation layer to conduct and have IT's inside surface equal the ambient temperature.
I used Lumped Capacitance for the first calc - found the convection coefficient for the problem by solving for Re and then Nu - my Bi let me use Lumped Capacitance for an aluminum panel. When I ran the calc's for a Delrin panel my Bi was > .1 so I used the approximation method, getting the coefficients from a table, solving for Fo and then solving for my time.
I believe that was correct, and the results seem realistic.
When it comes to the conduction through the insulation I am running into issues. I do not have any convection going on at this point, it is simply a constant temperature boundary condition on the outside of the insulation. Ts=Tamb (surface=ambient). I can't remember a way to use anything with an h value in it for this calculation (don't think you do/can), so I've been looking at transient conduction with an infinite solid.
I've tried the following:
1) Transient conduction through infinite solid (like soil)
2) Transient conduction through infinite solid of a cuboidal shape w/ constant surface temp
3) Transient conduction through infinite solid of a plane wall w/ constant surface temp
I figured #3 would be easiest and give me an approximate answer, but the answer does not seem realistic.
I realized that the cuboidal shape was probably not the correct choice and instead tried a plane wall.
When I try #2 and #3 I seem to get stuck and can't get answers that make sense. Here's the process I've been trying for that calc:
1) use the approximate solution for q* (dimensionless conduction heat rate) for when Fo >=0.2 with the interior case of a plane wall(since it should be enough time to satisfy this): 2exp(-Z^2*Fo), where Z=PI/2
2) I figured I wanted to solve for the time in Fo, where Fo= alpha*t/Lc^2
3) Saw that q* can also equal: Qs"*Lc/k*(Ts-Ti), where Qs" is the surface heat flux, and tried to solve for Qs" with it equaling k(Ts-Ti)/sqrt(pi*alpha*t) - this led to bad numbers. Then I thought, maybeI want to find when q* equals the steady state qss*
Should I set my equation for q* equal to zero since it approaches 0? Do I use something else?
I could keep going on with what else I've tried but there's no sense as none of it has worked. I'm kind of lost at what to do....any help?
I'm a newly registered member here but have been onlooking for awhile now. Stuck on what I feel like should be an easy problem...but can't waste any more time trying different methods and need some guidance.
I am currently designing an electronics enclosure which I am trying to have maintain a near room level temperature for as long as possible in a freezer. My ambient air is moving, so I have forced convection. I will have a sturdy outer panel for the enclosure along with foam insulation on the inside.
I've been working on the calculations to determine the time it will take for the inside surface of the outer panel's wall to reach ambient temperature, and then to determine how long it will take for the insulation layer to conduct and have IT's inside surface equal the ambient temperature.
I used Lumped Capacitance for the first calc - found the convection coefficient for the problem by solving for Re and then Nu - my Bi let me use Lumped Capacitance for an aluminum panel. When I ran the calc's for a Delrin panel my Bi was > .1 so I used the approximation method, getting the coefficients from a table, solving for Fo and then solving for my time.
I believe that was correct, and the results seem realistic.
When it comes to the conduction through the insulation I am running into issues. I do not have any convection going on at this point, it is simply a constant temperature boundary condition on the outside of the insulation. Ts=Tamb (surface=ambient). I can't remember a way to use anything with an h value in it for this calculation (don't think you do/can), so I've been looking at transient conduction with an infinite solid.
I've tried the following:
1) Transient conduction through infinite solid (like soil)
2) Transient conduction through infinite solid of a cuboidal shape w/ constant surface temp
3) Transient conduction through infinite solid of a plane wall w/ constant surface temp
I figured #3 would be easiest and give me an approximate answer, but the answer does not seem realistic.
I realized that the cuboidal shape was probably not the correct choice and instead tried a plane wall.
When I try #2 and #3 I seem to get stuck and can't get answers that make sense. Here's the process I've been trying for that calc:
1) use the approximate solution for q* (dimensionless conduction heat rate) for when Fo >=0.2 with the interior case of a plane wall(since it should be enough time to satisfy this): 2exp(-Z^2*Fo), where Z=PI/2
2) I figured I wanted to solve for the time in Fo, where Fo= alpha*t/Lc^2
3) Saw that q* can also equal: Qs"*Lc/k*(Ts-Ti), where Qs" is the surface heat flux, and tried to solve for Qs" with it equaling k(Ts-Ti)/sqrt(pi*alpha*t) - this led to bad numbers. Then I thought, maybeI want to find when q* equals the steady state qss*
Should I set my equation for q* equal to zero since it approaches 0? Do I use something else?
I could keep going on with what else I've tried but there's no sense as none of it has worked. I'm kind of lost at what to do....any help?