kamikazeCHIP
Industrial
- Apr 9, 2009
- 10
I am trying to develope a test to verify that an O-ring is sufficiently sealing. The O-ring is used to keep WEG out of the electronics portion of the unit. The WEG is being used to cool the unit.
I want to test the unit by pressurizing with air instead of pumping WEG. I want to use air for producibitility/timely build reasons. Since air molocules are smaller than WEGs I'm assuming air will leak more. Therefore, I am trying to come up with an acceptable amount of air leak that will validate the O-ring will not leak with the use of WEG. Does anyone have any input or experience comparing air leaks to a liquid leak? Any input on the kinds of experiements I should perform? Thanks.
I want to test the unit by pressurizing with air instead of pumping WEG. I want to use air for producibitility/timely build reasons. Since air molocules are smaller than WEGs I'm assuming air will leak more. Therefore, I am trying to come up with an acceptable amount of air leak that will validate the O-ring will not leak with the use of WEG. Does anyone have any input or experience comparing air leaks to a liquid leak? Any input on the kinds of experiements I should perform? Thanks.