Can anyone recommend a potting compound for an electronic circuit card that could withstand JP10 fuel vapour for 30 days without significant swelling or degradation ?
Try to look at BMS8-68D. This is also found by part number CS3808 and is multi part kit. Boeing uses this potting compound on electrical connectors for fuel qty system and is in JP-8. I don't know if it is compatible with MIL-P-87107, but chances are good?