I am not sure that my understanding of HIC is in line with that. I can certainly agree with the idea that a metal's microstructure that exhibits a predisposition towards accumulating needle-like inclusions at grain boundaries (such as manganese sulfide) will be prone to cracking, but in my mind that is more an SSCC issue, not as much a HIC issue. My understanding is that HIC has more to do with dissociation of hydrogen-bearing compounds (such as H2S in water) that liberates atomic hydrogen which is small enough to permeate into the steel, whereupon if conditions and chemistry are right, molecular hydrogen can form at voids to promote a step-wise blistering across the metal thickness.
I guess what you are saying is that while the mechanisms are different, the conditions (chemically and micro structurally) giving rise to them are similar. OK, upon typing this, that makes sense to me now.
Can you elaborate a bit on how the entrapment of molecular hydrogen at voids is beneficial? Is it sort of like the hydrogen sponges out the other trace elements that otherwise might precipitate at grain boundaries?
Metallurgy is not my thing...kind of a black art to me.
Regards,
SNORGY.