mark0310
Mechanical
- Sep 7, 2006
- 22
Hi,I have also posted this enquiry to the Polymers forum because they may be equally able to assist....there may be a better way of doing this?
My issue is that I have an application that requires an electrically insulating (breakdown voltage better than 2000 vac)material with excellent thermal conduction (better than 0.5 C-in2/W)to be used between a long pcb 150mm x 25mm and it's heat sink (has same mating area).We are not set up to use applied greases, also the PCB has European voltage to both sides, so I have looked at the usual options of thin (circa 0.15mm) adhesive backed materials (Polyimide, Silicon) from suppliers such as Kunze, Bergquist, Chomerics and Aavid but the one big problem I have is that I cannot maintain a pressure between the pcb and the heat sink, so with the adhesives I am reliant upon the glue strength of the adhesive. The performance figures from the suppliers all show that the thermal conductivity is much lower when there is little pressure applied.I have no knowledge of phase change materials, if I can get this insulation to behave as for the polymer (polyethylene??)from a glue gun then after application (heating up and cooling down in a low temperature oven)the bond strength between the pcb and heat sink should be good. I've enquired of 2 of the suppliers and they do market phase change materials, but they're soft at room temperature....so no good...any suggestions?
My issue is that I have an application that requires an electrically insulating (breakdown voltage better than 2000 vac)material with excellent thermal conduction (better than 0.5 C-in2/W)to be used between a long pcb 150mm x 25mm and it's heat sink (has same mating area).We are not set up to use applied greases, also the PCB has European voltage to both sides, so I have looked at the usual options of thin (circa 0.15mm) adhesive backed materials (Polyimide, Silicon) from suppliers such as Kunze, Bergquist, Chomerics and Aavid but the one big problem I have is that I cannot maintain a pressure between the pcb and the heat sink, so with the adhesives I am reliant upon the glue strength of the adhesive. The performance figures from the suppliers all show that the thermal conductivity is much lower when there is little pressure applied.I have no knowledge of phase change materials, if I can get this insulation to behave as for the polymer (polyethylene??)from a glue gun then after application (heating up and cooling down in a low temperature oven)the bond strength between the pcb and heat sink should be good. I've enquired of 2 of the suppliers and they do market phase change materials, but they're soft at room temperature....so no good...any suggestions?