Transient1
Mechanical
- Jan 31, 2007
- 267
In regards to Printed Circuit Boards, after I find the equivalent stiffness of a laminate, EI, I would like to extract the effective young's modulus E. My goal is to perform a FEA analysis using just a solid with equivalent properties rather than modeling each layer.
The equation I used for equivalent EI is
EI_equiv = Sum for each layer [ (E_i*I_i)+ (y_i - y_n)^2 * E_i*A_i]
y_i=neutral axis for the layer i
y_n=neutral axis of PCB
For Stress calculations I could estimate I=EI_equiv/I_layer
Dividing EI by the sum of I_i, doesn't seem to yield a logical answer. I get a young's modulus less than the young's modulus of each individual layer.
Can anyone shed some light on effective young's modulus calculations? Thanks in advance.
The equation I used for equivalent EI is
EI_equiv = Sum for each layer [ (E_i*I_i)+ (y_i - y_n)^2 * E_i*A_i]
y_i=neutral axis for the layer i
y_n=neutral axis of PCB
For Stress calculations I could estimate I=EI_equiv/I_layer
Dividing EI by the sum of I_i, doesn't seem to yield a logical answer. I get a young's modulus less than the young's modulus of each individual layer.
Can anyone shed some light on effective young's modulus calculations? Thanks in advance.