Decoupling Thermal Models

[cpfmarvin]

When modeling chip-submount assemblies for thermal analyses, the difficulty is often modeling the entire assembly due to significant dimension differences (small chip on large submount). I remember reviewing procedures that involve decoupling the model and solving the components separately per an iterative process; however, I’m having difficulty in determining the governing equations.

Can anyone suggest procedures or reference to information for modeling such thermal simulations?

Thanks