Good Morning, back from a few days of details and cedar fever.....central Texas allergies are the worst.
SREID: The phase change materials are superior for gap filling, they do not have as good a TC, however due to the very thin (.003)and gap filling abilities they have outstanding LOW thermal resistivity. Unfortuately I am told to "stick" with T805 for rework and ease of cleanup.
Mike: WELCOME TO MY WORLD...............I am ex Moto and I have the APP notes pasted to the cubicle wall. They note two 440 screws @ 5in lb offer 450 lbs of force. The device is .2 sqin in size. They use T805 undere the device, however we solder it down. Yes, not only is there a bending moment with the package, then there is a PCB around it and the PCB is soldered to the HS.
GregL: thanks for the info...... (The pictures do not come through, will attempt to contact you via your home page.) They are using Thermal Paste in the lab, everyone is a thermal genius in there, So I let them do what they want, I am focused on the shippable product.
I received a sample of the Prescale FugiFilm, interesting stuff. It works, however like statistics you can make it do what you want, to an extent. The imprints simply do not show the pressure we expected in the center of the HS. I used the sample without the T805 between the two HS blocks, the argument here which is correct? I do get two different, however small,impressions if I use the T805 material or not. Any experience out there on the Fugi material?