I am modeling an electronic heat sink specified to 10,000 ft. How should I change the pressure to handle this? Will lowering the environmental pressure correct the elevation change?
-R
I have added the power and separated the die (heat source) and chip package, but I would still like to simplify the component as much as possible.
Do you have any suggestions? This is a system level analysis and most details will have to be ommited.
Thanks,
R
I am cooling an electronics enclosure and there are several heat sources I need to model. These are modeled as homogeneous blocks, so I do not think I need the exact thermal characteristics of each chip.
Has anyone worked on this?
-R
I read it is bad practice to put countersunk screws in plastic, since it spreads the material. Does anyone have any experience with this?
Thanks,
Rodney
Is there some where you can download nuts with the actual tapped section intact. I can easily find the screws and bolts but not the nuts. I am creating a mold and need have the tapped section modeled.
Thanks,
-R
Has anyone looked for a top grade thermal epoxy? I need to pot an entire board and a Celeron CPU will be running very hot. This will be the thermal barrier to the heat sink that will sit on top of the entire borad.
Thanks,
Rodney
Sorry, I meant to say countersink. From what I have seen in other spec's is that the 82 degree is .162 and the 100 degree is .172. I got both of those off of McMaster Carr's website and from another publication.
Thanks,
Rodney
Are there anyother common specs for #2 screws other than ASMI? I have a part with a hole spec'd for a #2 flat head counterbore and the diameter is .155?
Thanks,
Rodney