Hi,
I am doing an evaluation with the thermal conditions (expansion coefficient on)- same temperature for the whole assembly - and without thermal conditions - meaning that the temperature is given but thermal expansions are off (using APDL snippet.
When I see the equivalent stress for the thermal load case the stresses increase even though the assembly is at same temperature i.e. all parts have same temperature and same material properties.
Is it because of bonded contact in the model and bolts modeled as beams?
Shiraz
Sr. Engineer
I am doing an evaluation with the thermal conditions (expansion coefficient on)- same temperature for the whole assembly - and without thermal conditions - meaning that the temperature is given but thermal expansions are off (using APDL snippet.
When I see the equivalent stress for the thermal load case the stresses increase even though the assembly is at same temperature i.e. all parts have same temperature and same material properties.
Is it because of bonded contact in the model and bolts modeled as beams?
Shiraz
Sr. Engineer