Log In

Come Join Us!

Are you an
Engineering professional?
Join Eng-Tips Forums!
  • Talk With Other Members
  • Be Notified Of Responses
    To Your Posts
  • Keyword Search
  • One-Click Access To Your
    Favorite Forums
  • Automated Signatures
    On Your Posts
  • Best Of All, It's Free!
  • Students Click Here

*Eng-Tips's functionality depends on members receiving e-mail. By joining you are opting in to receive e-mail.

Posting Guidelines

Promoting, selling, recruiting, coursework and thesis posting is forbidden.

Students Click Here


One Dimensional Consolidation Question

One Dimensional Consolidation Question

One Dimensional Consolidation Question

Hi all! I'm a new engineer and have been working at a geotechnical company for a couple of months. I am trying to read standards, publications, test procedures, and get as much information as possible for my job. We also do soil laboratory testing, and I have a problem with the oedometer test, and wanted to discuss it with someone who has more experience than me.

I have set up a clay sample and want to perform the 1D consolidation test. The sample diameter was 7.5cm and the height 20mm. After setting up the sample in the assembly (with porous stones and filters included), I filled the assembly with water. Now, in order to keep the sample from swelling, the ASTM standard says to apply a stress of around 5 kPa (could be more or less, depending on the soil). In my case, in order to avoid swelling and bring the sample height back to 20mm (it got swollen as soon as i put the water), i needed to apply the stress of 100 kPa.

I was originally planning a loading series of 50 kPa, 100 kPa, 200 kPa, 400 kPa, (and then perform the unloading and reloading accordingly).

My question is, what should the next loading series be? Should I continue with 200 kPa (since the first load needed to be 100 kPa)? Should I continue with my original plan and add (50kPa, 100kPa, 200kPa...) to the initial 100 kPa stress?

I would really appreciate if you could give me some guidance.

Thank you so much!

Red Flag This Post

Please let us know here why this post is inappropriate. Reasons such as off-topic, duplicates, flames, illegal, vulgar, or students posting their homework.

Red Flag Submitted

Thank you for helping keep Eng-Tips Forums free from inappropriate posts.
The Eng-Tips staff will check this out and take appropriate action.

Reply To This Thread

Posting in the Eng-Tips forums is a member-only feature.

Click Here to join Eng-Tips and talk with other members! Already a Member? Login


eBook - 10 Reasons to Choose CATIA on the Cloud
To compete in today’s fast-paced and competitive market, smaller and newer firms need a powerful platform that will enable them to compete with bigger players, without the heavy investments needed in computer hardware, software and personnel. Download Now
White Paper - Smart Manufacturing for Electronics
This white paper describes a transformative approach to electronics manufacturing made possible by the addition of Mentor Graphics to the Siemens family. It describes a completely digitalized strategy that supports both printed circuit board (PCB) and mechanical design and manufacturing, uniting the entire product lifecycle – from idea and production to customers and back. Download Now

Close Box

Join Eng-Tips® Today!

Join your peers on the Internet's largest technical engineering professional community.
It's easy to join and it's free.

Here's Why Members Love Eng-Tips Forums:

Register now while it's still free!

Already a member? Close this window and log in.

Join Us             Close