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Minimize bubbles and voids in encapsulation process

Minimize bubbles and voids in encapsulation process

Minimize bubbles and voids in encapsulation process

(OP)
Anybody aware of a published reference guide or somthing similar that explains good industrial practices used to minimize voids and bubbles during the encapsulation of electronics?  

RE: Minimize bubbles and voids in encapsulation process

It's usually just your specific procedures.  Don't do things that entrain air.

If you can't tolerate any bubbles then often you put the mixture into a vacuum briefly before using it.  This draws the gas out of your mix.

Keith Cress
kcress - http://www.flaminsystems.com

RE: Minimize bubbles and voids in encapsulation process

I worked at a place where potting compounds were widely used.  To get air bubbles out of liquid potting compounds the compounds (and often the potted assemblies) were placed in a vacuum.  I don't recall how powerful the vacuum was but I'm sure that any potting compound mfgr can provide good advice along those lines.
 

Tunalover

RE: Minimize bubbles and voids in encapsulation process

Two words:   vacuum degas

Timelord

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