The primary reason for thinner copper is to etch thinner lines.
Say you want to etch 2 mil lines and your copper is 1.4 mils thick, there's alot of undercut in the etching process for that case. Your impedance will be inconsistent for thin lines in that case, and pretty good for wider lines.
For most patch antennas, 0.5 vs. 1 oz copper isn't too much of a difference.
electrodeposited cracks easier with vibe and cold, but etches cleaner and more accurately.
If you have a large patch array or interferemeter array at 18-40 ghz and use rolled copper, when the copper is etched away, your circuit board physically shrinks (or springs back) with rolled copper since the rolling of copper onto dielectric board (with heat) stretches the base dieletcric. You actually have to make artwork larger in dimension than you want to plan on the shrinkback.
Read Rogers corp. info for more details.
kch
khiggins@toyon.com