Junction vs. Case Temperatures
Junction vs. Case Temperatures
(OP)
Quick question from a mechanical engineer to electrical engineers:
How much hotter is the junction temperature compared to the case temperature for a chip?
Is there a range it is likely to fall within or is this a much too vague question?
Specifically, if the spec for maximum junction temperature is stated as 100degreesC what would you recommend the chip case temperature be limited to? Just looking for a ball-park figure for initial calcs.
RE: Junction vs. Case Temperatures
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RE: Junction vs. Case Temperatures
RE: Junction vs. Case Temperatures
Been checking all over the net for datasheets and all can I find is the resistance from the die to the legs. The chip has a heat spreader plate integrated on its underside. Ideally I would want the resistances die to spreader plate, die to board via legs and die to case exposed to air to determine the % power exiting through the case and spreader plate where the temp is measured.
RE: Junction vs. Case Temperatures
However, I know that the topside (air exposed) of the case is 10degC hotter than the spreader plate. if I know the power I could estimate the jucntion temperature using this temeperature relationship and assuming the resistance from junction to case is a multiple of the resistance from junction to spreader plate.
Would it be reasonable to assume that the resistance from junction to case is 10x that from junction to spreader plate or more like 100x?
RE: Junction vs. Case Temperatures
Possible for all devices containing at least on pn-junction accessible via the pins.