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Solder Joint Reliability- Thermal/Mechanical Fatigue

thread1616-186400

Solder Joint Reliability- Thermal/Mechanical Fatigue

Solder Joint Reliability- Thermal/Mechanical Fatigue

(OP)
I am begining to delve in to SJR. I have found numerous papers and ANSYS macros that seem tailored to BGA, SMT, and other 'advanced' mounting configurations. Yet, I have found relatively little about the common leaded components. I would like to model these connections in ANSYS but would like more backgorund in the proper modeling of the lead, solder, and PCB. Does anyone have any experience in this and can suggest a good source of information?

RE: Solder Joint Reliability- Thermal/Mechanical Fatigue

(OP)
Thank you for your responses. They were both helpful.

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