×
INTELLIGENT WORK FORUMS
FOR ENGINEERING PROFESSIONALS

Contact US

Log In

Come Join Us!

Are you an
Engineering professional?
Join Eng-Tips Forums!
  • Talk With Other Members
  • Be Notified Of Responses
    To Your Posts
  • Keyword Search
  • One-Click Access To Your
    Favorite Forums
  • Automated Signatures
    On Your Posts
  • Best Of All, It's Free!

*Eng-Tips's functionality depends on members receiving e-mail. By joining you are opting in to receive e-mail.

Posting Guidelines

Promoting, selling, recruiting, coursework and thesis posting is forbidden.

Students Click Here

Manufacuring Thermionic Power Chips

Manufacuring Thermionic Power Chips

Manufacuring Thermionic Power Chips

(OP)
Hello,

I'm new to this board, but I'd like to get some verification on an idea I'm working on.

In 2001, Eneco, a company owned and operated by Professors at MIT, delivered their "Power Chip", a semiconductor structure that delivers to the solid state realm the powers of a vacuum tube thermal diode.

However, their packaging technique has limited their ability to market the device. In the following 5 years, they still have not managed to make progress in this field.

I believe I may have found a solution to their manufacturing trouble, but I need verification from outside sources.

My idea is fairly basic. I want to rotate the diode interconnect assembly 90 degrees to bring it parallel to the substrate. This should make the process much easier to develop. Right now the device requires a laminating technique where the junctions are perpendicular to the substrate, which is very difficult to manufacture on such as small scale. I've included a couple pictures of broken open TECs (which use a perpendicular diode array manufacturing technique) as well as some lego designs of the new arrangement for visualization purposes. Please note that the final device would operate perpendicular to the heat source.

Please check out the images at http://morlock.newdor.com/

Thank you for your time.

RE: Manufacuring Thermionic Power Chips

Frankly, I don't see that you invented anything that works.  Heat flow runs parallel to current flow for a TEC.  Your layout makes no physical sense.

TTFN



RE: Manufacuring Thermionic Power Chips

It's supposed to be a better TE cooler/heater than bulk material devices because the tunnelling vacuum junction blocks thermal conduction.  Since the bulk material can also be made thinner and more conductive, the net heat flow can be greater and more efficient.

However, the devices operate on the same general principles as the standard TE device, i.e., the current flow itself moves the heat.  That makes putting the hot and cold surfaces parallel to the current flow a non-starter

TTFN



RE: Manufacuring Thermionic Power Chips

(OP)
You wouldn't see a temperature gradient in a powered version of this device?

I understood that the evolution of heat took place at the junction interconnects, not really inside the junction itself.

As for the hot and cold surfaces, they're still there, just dealing with hot and cold edges now instead.

RE: Manufacuring Thermionic Power Chips

(OP)
Sorry, I meant heat evolution takes place within the interconnect, not inside the junction  or the ceramic substrate.

The internal design of each diode prevents return flow, but the heat evolves into a hot carrier electron or hot carrier hole at the interconnect as it begins to traverse the semiconductor.

Which means that in this design heat flow would still be running in parallel to the current flow, just perpendicular to the substrate.

RE: Manufacuring Thermionic Power Chips

No heat is generated; it's moved by the current.  The purpose of the ceramic substrate is to remove heat from the diodes and to spread the heat for the heat sink.  Your substrates are shown in the pictures to be paralleling the current flow, thereby shorting out and reversing the junctions' heat transfer process.

TTFN



RE: Manufacuring Thermionic Power Chips

(OP)
It only runs down to ambient.

It's designed to cool to room temperature.

Until that point, the thermal flow is always downhill.

Red Flag This Post

Please let us know here why this post is inappropriate. Reasons such as off-topic, duplicates, flames, illegal, vulgar, or students posting their homework.

Red Flag Submitted

Thank you for helping keep Eng-Tips Forums free from inappropriate posts.
The Eng-Tips staff will check this out and take appropriate action.

Reply To This Thread

Posting in the Eng-Tips forums is a member-only feature.

Click Here to join Eng-Tips and talk with other members! Already a Member? Login


Resources

Low-Volume Rapid Injection Molding With 3D Printed Molds
Learn methods and guidelines for using stereolithography (SLA) 3D printed molds in the injection molding process to lower costs and lead time. Discover how this hybrid manufacturing process enables on-demand mold fabrication to quickly produce small batches of thermoplastic parts. Download Now
Design for Additive Manufacturing (DfAM)
Examine how the principles of DfAM upend many of the long-standing rules around manufacturability - allowing engineers and designers to place a part’s function at the center of their design considerations. Download Now
Taking Control of Engineering Documents
This ebook covers tips for creating and managing workflows, security best practices and protection of intellectual property, Cloud vs. on-premise software solutions, CAD file management, compliance, and more. Download Now

Close Box

Join Eng-Tips® Today!

Join your peers on the Internet's largest technical engineering professional community.
It's easy to join and it's free.

Here's Why Members Love Eng-Tips Forums:

Register now while it's still free!

Already a member? Close this window and log in.

Join Us             Close