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Electroplating lead to copper

Electroplating lead to copper

Electroplating lead to copper

(OP)
I was currently put in the position to lead plate a copper strap under a 95%Pb 5%Sn MSA bath.  I am not sure of the concentration of the chemicals all I know is it is composed of Solderon MHS, Solderon Pb concentrate, and Solderon Acid.  I need to make more solution, if anyone might know the concentration of these chemicals please reply.   

Thank you

RE: Electroplating lead to copper

When in doubt, read the instructions!?  Try the supplier:
http://electronicmaterials.rohmhaas.com/products/default.asp?caid=500&keyword=solderon

Also, searching turns up a few articles perhaps relevant:
'SolderOn Lead Analysis' http://www.thinktink.com/stack/volumes/volvi/tllead.htm

From another,
"We made up our 100-liter plating bath as follows: Solderon lead concentrate, 5% by volume; Solderon tin, 0.5%; Solderon acid 35%; MHS-L additive 5%; DI water 55%. The concentrates contain 450 g/l lead and 120 g/l tin, respectively, plus some additional acid."
-- it gives a 4 atom % tin deposit.
http://66.102.7.104/search?q=cache:SeQcw_XxCLIJ:resonator.physics.sunysb.edu/srf/sneap96/sneap96_paper.ps+Solderon+lead+plating&hl=en&gl=us&ct=clnk&cd=4  

Note that the original supplier was LeaRonal which merged with Shipley and then Rohm & Haas.

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