What are the possible manufacturing issues and drawbacks involved in using a pad layout that is exactly the same dimensions as the <br>maximum tolerance of the footprint of the device being installed? Can I get away with having a 7% overhang of the interior "heel" of the surface mount part relative to the pad? Why should I follow an IPC recomended pad layout that takes up so much of my board space when the device will fit snug on a smaller layout?
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Circuit board pad layout.
- Thread starter mosfit
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