I am building a device that has some moving parts that probably can not help but touch each other and wear. I know that the semiconductor process industry is most concerned with particle generation. Does anyone have recomendations, pointers to literature or anything that would help with minimizing particle generation? And when particles are generated how to limit their spread?
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Generation of particles from two rubbing surfaces
- Thread starter danap2005
- Start date
The key is that the industry is concerned with AIRBORNE particles, for the most part. That's why all instruments are used under laminar flow hoods.
You can also enclose the machinery within its own enclosure with appropriate filtering as needed.
TTFN
You can also enclose the machinery within its own enclosure with appropriate filtering as needed.
TTFN
danap2005,
Ir is right, any mechinically touching parts are usally enclosed in a case sometimes with exhaust ported out to a gray area (class 1000 or so). In addition most surfaces above the process parts are structered to allow clean air (class 1) to laminar flow without turbelance. People also generally keep all moving parts below the process substrates. Think no particles at the wafer area.
-elf
Ir is right, any mechinically touching parts are usally enclosed in a case sometimes with exhaust ported out to a gray area (class 1000 or so). In addition most surfaces above the process parts are structered to allow clean air (class 1) to laminar flow without turbelance. People also generally keep all moving parts below the process substrates. Think no particles at the wafer area.
-elf
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