Hi,

I need some help/advice on the best way to solder or epoxy a gold packaged device onto a gold plated track.  At present we use an Indium solder, however it is very time consuming as the substate tracking has to be pre-tinned and each individual component is pre-tinned before the packages are fully soldered to the circuit.  Also the Indium is not easy flow satisfactorily.

We can change the track plating to another material but the packages have to remain gold.  Can anyone suggest a different technique/process or suggest a suitable epoxy alternative that I can investigate.

Thanks