using *gap conductance

[as3029]

i am doing a warm stamping analysis and need to simulate heat transfer between binder and blank. I am using *GAP CONDUCTANCE for it. my blank is and binder both are shell elements (elastic plastic). I am interested in specifing gap conductance as a function of distance and pressure between the blank and binder. The data lines can define that but my problem what elements should i use. The shell elements needed for heat transfer is DS4 which do not have motion degrees of freedom. In any stamping analysis the binder presses against the blank and the contact pressure gradually increases. I cannot simulate because of the element type for heat transfer does not take *Dload and motion D.O.F.