Thermal imaging and FEA 1

[cbrtech]

Hi I am new to this forum.

I am interested in knowing about how to combine Thermal Imaging with Finite Element Analysis to predict geometrical changes in plastics parts during cooling. I would be grateful is someone could tell me if they know any companies who combine these technologies and if there are some interesting articles written about the combination and usefullness of combining these technologies.

Best regards

Jens

 

[JKEngineer]

Jens -

I have published several papers on exactly that combination. The oldest was published at the SPIE Thermosense conference in 1999, paper 3700-1. It is available in the conference proceedings and on the CD-ROM edited by Snell and Burleigh. I have also published papers on it at IRInfo in 2002, IRUG (EPRI's Infrared User Group Conference) in 2002, and InfraMation in 2002. You can see some discussions on the topic on my website.

I currently offer both services, individually and in combination.

If you attend this year's Aerosense/Thermosense conference in April (

http://www.spie.org)

I will be presenting a short course on "FEA for Thermography and Hardware Design".

HTH
Jack Jack M. Kleinfeld, P.E. Kleinfeld Technical Services, Inc.
Infrared Thermography, Finite Element Analysis, Process Engineering

http://www.KleinfeldTechnical.com