If by "soldering" you mean old-style automated wave soldering the answer is no. The whole point about surface mount parts is that they are very small and the components can only be soldered on the side they mount on, which rules out automated wave soldering as the solder will "bridge" most of the pins due to surface tension of the solder, even with the application of lots of flux. The accepted method is by hot air re-flow soldering, where the component leads and circuit board pads are pre-tinned, requiring no additional solder to be added.
It is possible to hand-solder some surface mount components and ICs, but this requires minute soldering irons and extreme skill. As a consequence it is normally reserved for rectification of occasional faulty joints on boards, not as a routine volume production method.