Solder Joint Reliability- Thermal/Mechanical Fatigue

[Transient1]

I am begining to delve in to SJR. I have found numerous papers and ANSYS macros that seem tailored to BGA, SMT, and other 'advanced' mounting configurations. Yet, I have found relatively little about the common leaded components. I would like to model these connections in ANSYS but would like more backgorund in the proper modeling of the lead, solder, and PCB. Does anyone have any experience in this and can suggest a good source of information?

 

[IRstuff]

The Center for Advanced Life Cycle Engineering (CALCE) at University of Maryland:

http://www.calce.umd.edu/

and others have done extensive investigations into the physics of failure.

TTFN

FAQ731-376

 

[sreid]

A "Bible" on the subject.

http://www.amazon.com/Preventing-Vi...3056921?ie=UTF8&s=books&qid=1178726868&sr=1-3

 

[Transient1]

Thank you for your responses. They were both helpful.