SeattleChris
Electrical
- Mar 29, 2007
- 8
Hello,
I have a general question about EMC treatments for ground interfaces associated with high speed interfaces. I've seen the cat skinned several different ways for USB2.0 connectors and I'd like to get a better understanding of why these different approaches are taken. It would be nice if I could post a schematic here but I guess words will have to suffice.
For a USB2.0 end-point device, I usually insert a ferrite bead between the USB signal ground and digital ground on the PCB to block bi-directional radiation on that line. For high speed interfaces, education has taught me (perhaps incorrectly) that shield GND should be DC coupled on both ends of the cable. However, I often see AC coupling (0.01uF) in parallel with a 1-M ohm resistor between the local connector shield ground and signal ground on the PCB.
My hypothesis is that this "almost AC-coupled" approach shunts HF noise from the shield quickly while correcting any appreciable DC offsets between shield and signal ground over a longer period of time, but I'm not sure why this is necessary.
Can anyone explain the reason for this approach and perhaps shed some light on theoretical vs. actual needs here? It's easy to overload interfaces with filters, ESD protection, etc. but my focus recently has been on portable high-volume consumer electronics devices where both the BOM and form-factors are very tight. So my target is always the most concise (both necessary and sufficient) approach.
Thank you in advance for your help!
Regards,
Chris
I have a general question about EMC treatments for ground interfaces associated with high speed interfaces. I've seen the cat skinned several different ways for USB2.0 connectors and I'd like to get a better understanding of why these different approaches are taken. It would be nice if I could post a schematic here but I guess words will have to suffice.
For a USB2.0 end-point device, I usually insert a ferrite bead between the USB signal ground and digital ground on the PCB to block bi-directional radiation on that line. For high speed interfaces, education has taught me (perhaps incorrectly) that shield GND should be DC coupled on both ends of the cable. However, I often see AC coupling (0.01uF) in parallel with a 1-M ohm resistor between the local connector shield ground and signal ground on the PCB.
My hypothesis is that this "almost AC-coupled" approach shunts HF noise from the shield quickly while correcting any appreciable DC offsets between shield and signal ground over a longer period of time, but I'm not sure why this is necessary.
Can anyone explain the reason for this approach and perhaps shed some light on theoretical vs. actual needs here? It's easy to overload interfaces with filters, ESD protection, etc. but my focus recently has been on portable high-volume consumer electronics devices where both the BOM and form-factors are very tight. So my target is always the most concise (both necessary and sufficient) approach.
Thank you in advance for your help!
Regards,
Chris