RPstress
Aerospace
- Jun 4, 2003
- 846
We have some flat HS carbon fibre/PR 520 epoxy RTM plaques which are coming out a bit thinner than we think they should. The tool cavity is 3.09 mm (0.122") deep at room temp and the cure is 180°C.
The final room temp plaque thickness is averaging about 3.026 mm (0.119"), so it's shrinking about 2.1% for a 160°C cool down.
The resin Tg is in advance of (higher than) the cure temp, so just from a CTE estimated at 40 microstrain/°C we'd expect to get a 0.64% shrinkage. (We have ~59%–62% fibre vol and pure resin CTE is about 53; laminate CTE might actually be nearer 25–30 if transverse fibre CTE is about 9.)
Could the additional reduction be due to resin shrinkage on cure? It seems a bit high, but there is rather limited data for this resin, so it may be possible that that's it.
Does anyone have any thoughts/experience of PR 520?
The final room temp plaque thickness is averaging about 3.026 mm (0.119"), so it's shrinking about 2.1% for a 160°C cool down.
The resin Tg is in advance of (higher than) the cure temp, so just from a CTE estimated at 40 microstrain/°C we'd expect to get a 0.64% shrinkage. (We have ~59%–62% fibre vol and pure resin CTE is about 53; laminate CTE might actually be nearer 25–30 if transverse fibre CTE is about 9.)
Could the additional reduction be due to resin shrinkage on cure? It seems a bit high, but there is rather limited data for this resin, so it may be possible that that's it.
Does anyone have any thoughts/experience of PR 520?