jr852
Military
- Jan 10, 2007
- 3
I am packaging a power supply to be used in a high vibration environment on an aircraft. Right now we are considering potting compound since serviceability is NOT a concern. Reliability is critical. We also need to use a low complexity design for the PCB mounting scheme and thermal transfer. Some leading particulars:
- Shock mounting is not an option
- Through hole components on a PCB, both sides
- Needs to be tough and/or flexible so it can withstand high vibration stresses and wide temperature swings
- Will be mounted in an aluminum enclosure
- Some of the components are heavy and the solder connections will not withstand the vibration levels without additional support.
- Since it is a power supply, good thermal conductivity to the case is important
- The PCB will be crowded, not much space between components.
- We have some latitude on the enclosure design, including custom machining (from billet) since it is a low production item.
I have identified several heat activated two-part epoxy compounds that look like they will work, including products from Loctite, Permatex, and Aremco. I am looking at of-the-shelf epoxies since I cannot live with a long lead time.
Questions:
1. Some of the epoxies have a high viscosity at room temperature. Can I expect a significant reduction in viscosity when I heat the mixed epoxy to curing temperatures (on the order of 350 Deg F)? I want to get good component wetting for good heat transfer.
2. We will be minimizing the extra volume in the enclosure and are considering potting the entire volume of the enclosure (minus the components and PCBs). The thickness of the epoxy will be on the order of 1-2 inches. Are there notable potential pitfalls here, like curing shrinkage damaging the components? Curing shrinkage with one product is 0.003 in/in. Is this typical? Not all the products have this spec on their tech sheets.
3. Any suggestions for potting compounds I may have overlooked?
I know, I will be calling the epoxy supplier's applications engineers as soon as I can
I have also looked through this site and located some good information.
Thanks, this is a great forum.
- Shock mounting is not an option
- Through hole components on a PCB, both sides
- Needs to be tough and/or flexible so it can withstand high vibration stresses and wide temperature swings
- Will be mounted in an aluminum enclosure
- Some of the components are heavy and the solder connections will not withstand the vibration levels without additional support.
- Since it is a power supply, good thermal conductivity to the case is important
- The PCB will be crowded, not much space between components.
- We have some latitude on the enclosure design, including custom machining (from billet) since it is a low production item.
I have identified several heat activated two-part epoxy compounds that look like they will work, including products from Loctite, Permatex, and Aremco. I am looking at of-the-shelf epoxies since I cannot live with a long lead time.
Questions:
1. Some of the epoxies have a high viscosity at room temperature. Can I expect a significant reduction in viscosity when I heat the mixed epoxy to curing temperatures (on the order of 350 Deg F)? I want to get good component wetting for good heat transfer.
2. We will be minimizing the extra volume in the enclosure and are considering potting the entire volume of the enclosure (minus the components and PCBs). The thickness of the epoxy will be on the order of 1-2 inches. Are there notable potential pitfalls here, like curing shrinkage damaging the components? Curing shrinkage with one product is 0.003 in/in. Is this typical? Not all the products have this spec on their tech sheets.
3. Any suggestions for potting compounds I may have overlooked?
I know, I will be calling the epoxy supplier's applications engineers as soon as I can
Thanks, this is a great forum.