Hi,
I have a silicon wafer (4 inch in diameter, 200 micron thick) coated with a thin metal film (10 micron thick). The curvature of the wafer will be changed upon thermal cycling due to CTE mismatch. In order to simulate the stress evolution in Solidworks, the geometry is required to be fixed. However, I have hard time to define a proper fixture boundary condition.
Could you give me some suggestions? Thanks in advance.
I have a silicon wafer (4 inch in diameter, 200 micron thick) coated with a thin metal film (10 micron thick). The curvature of the wafer will be changed upon thermal cycling due to CTE mismatch. In order to simulate the stress evolution in Solidworks, the geometry is required to be fixed. However, I have hard time to define a proper fixture boundary condition.
Could you give me some suggestions? Thanks in advance.