zappedagain
Electrical
- Jul 19, 2005
- 1,074
I have an application where I need to convert the surface mount footprint (pads) of one device (similar to N-SOIC) to an existing board layout for another device (also similar to N-SOIC, but different spacing and number of pads). I'm picturing having the device mounted on a small PCB, and then soldering this PCB to the footprint on the existing board. I've seen this type of thing for thru-hole. Does anyone know of any options for surface mount devices?
I'm picturing a small C-clip that would clip over top and bottom side edge contacts on the adapter board. The spring force would hold it on the board, or it could be soldered to the top side. The bottom side would then look like a J-lead (gull wing) contact to mount on the bottom board. Does such a thing exist?
Another option might be to have vias placed so that they get milled through when the board outline is milled. This will leave a solderable surface on the 'edge' of the PCB between the top and bottom layers that could then be soldered to the bottom PCB. Has anyone tried this? I worry that the milling process might damage some vias. It seems this could be detected via a visual inspection before the adapter boards are used.
I'm picturing a small C-clip that would clip over top and bottom side edge contacts on the adapter board. The spring force would hold it on the board, or it could be soldered to the top side. The bottom side would then look like a J-lead (gull wing) contact to mount on the bottom board. Does such a thing exist?
Another option might be to have vias placed so that they get milled through when the board outline is milled. This will leave a solderable surface on the 'edge' of the PCB between the top and bottom layers that could then be soldered to the bottom PCB. Has anyone tried this? I worry that the milling process might damage some vias. It seems this could be detected via a visual inspection before the adapter boards are used.